LED package and method for producing the same

ABSTRACT

An LED package and method for producing the same are described. The LED package has an LED die with a conductive region-forming surface and a plurality of conductive regions disposed on the conductive region-forming surface. An insulation layer is formed on the conductive region-forming surface of the LED die, and has a plurality of openings corresponding to the conductive regions, respectively. A conductive member fills a respective opening, and is electrically connected a respective conductive regions to an exterior circuit.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an LED package and method for producingthe same, and particularly relates to a package and a method for asemiconductor wafer with high illumination and high mass production.

2. Background of the Invention

With respect to FIG. 26, a perspective view of a conventional LEDpackage including a LED die 90 is illustrated. The LED die 90 has aconductive region-forming surface 900 that is also a main light emissionsurface, and two conductive regions 901 disposed on the conductiveregion-forming surface 900. The LED die 90 has an opposed surfaceopposite to the conductive region-forming surface 900. The LED die 90 isconnected to a die-installation surface 910 of a substrate 91 via theopposed surface thereof. The conventional LED package further includestwo connection members 92 corresponding to the two conductive regions901, respectively. Each connection member 92 extends from thedie-installation surface 910 to a predetermined portion of a backsidesurface opposite the die-installation surface 910. The predeterminedportion of the die-installation surface 910 is used to connectelectrically an exterior component (not shown). Each conductive region901 of the LED die 90 is electrically connected to the correspondingconnection member 92 via a bonding wire 93. A protection layer isfurther provided to cover the LED die 90 and the bonding wire 93 on thedie-installation surface 910 of the substrate 91. The protection layer94 is made of transparent resin materials.

However, there are some disadvantages in the conventional LED packagementioned above. First, a wafer (not shown) is diced into plural dies90, and the dies 90 are disposed on respective substrates 91 in turn.The bonding wire 93 is applied for electrical connection. After theprotection layer 94 is formed, the conventional LED package is finished.Therefore, the period of manufacturing the same is too long to fabricateby mass production.

Second, light toward the opposed surface of the LED die 90, shown asdotted lines, is only partially usable, and the remaining light, shownas solid lines, is useless and wasted. Thus, the total amount of lightemitted through the main light emission surface 900 of the LED die 90,shown as dotted lines, is reduced, thereby, illumination of that typeconventional LED package cannot be improved effectively.

SUMMARY OF INVENTION

An LED package and method for producing the same are disclosed for highmass production and high illumination.

An LED package includes an LED die, an insulation layer and a conductivemember. The LED die has a conductive region-forming surface and aplurality of conductive regions disposed on the conductiveregion-forming surface. The insulation layer is formed on the conductiveregion-forming surface of the LED die, and has a plurality of openingscorresponding to the conductive regions, respectively. The conductivemember fills one of the openings, and electrically connects onerespective pad to an exterior circuit.

An LED package includes an LED die, a first insulation layer, a metallicreflection layer, a second insulation later, and a conductive member.The LED die has a conductive region-forming surface and a plurality ofconductive regions disposed on the conductive region-forming surface.The first insulation layer is formed on the conductive region-formingsurface of the LED die, and has a plurality of channels corresponding tothe conductive regions, respectively. The metallic reflection layer isformed on the first insulation layer, and has a plurality of throughholes corresponding to the channels, respectively. The second insulationlater is formed on the metallic reflection layer, and has a plurality ofopenings corresponding to the conductive regions via the channels andthe through holes, respectively. The conductive member fills one of theopenings, and electrically connects one of the conductive regions to anexterior circuit.

An LED package includes an LED die, a reflection layer, a substrate, abinding wire and a protection layer. The LED die has a conductiveregion-forming surface and a plurality of conductive regions disposed onthe conductive region-forming surface. The reflection layer is formed onan opposed surface of the LED die, opposite the conductiveregion-forming surface. The substrate has a die-installation surface onwhich the LED die is disposed via the reflection layer. The substrateincludes a plurality of connection members in accordance with theconductive regions for electrical connection, respectively, and eachconnection member extends from the die-installation surface to apredetermined portion of a back surface of the substrate, opposite thedie-installation surface, for electrically connecting to an exteriorcircuit. The binding wire connects one of the conductive regions and acorresponding connection member. The protection layer covers thesubstrate for enclosing the LED die and the binding wire.

A method for producing an LED package includes the following steps. (a)An LED wafer, which includes a plurality of LED sections. Each LEDsection includes a conductive region-forming surface and a plurality ofconductive regions disposed on the conductive region-forming surface.(b) An insulation layer is formed on the conductive region-formingsurface of each LED section, and the insulation layer is patterned witha plurality of openings that correspond to the conductive regions,respectively. (c) A conductive formation layer is made on the insulationlayer with the openings, and the conductive layer is removed to leave aconductive member filling each opening. (d) An exterior conductive bodyis arranged on the conductive member, and the LED wafer is diced into aplurality of LED packages.

A method for producing an LED package includes the following steps. (a)An LED wafer is provided, which includes a plurality of LED sections.Each LED section includes a conductive region-forming surface and aplurality of conductive regions disposed on the conductiveregion-forming surface. (b) A first insulation layer is formed on theconductive region-forming surface of each LED section. (c) A metallicreflection layer is made on the first insulation layer, and patternedwith a plurality of through holes to expose the first insulation layer.(d) The first insulation layer is patterned with a plurality of channelsthat communicate with the through holes, respectively, so as to exposethe corresponding conductive regions. (e) A second insulation layer isformed on the metallic reflection layer, and patterned with a pluralityof openings in accordance with the through holes and the channels, so asto expose the corresponding conductive regions. (f) A conductiveformation layer is disposed on the second insulation layer, an exposedportion thereof that is higher than the second insulation layer isexposed, and a conductive member is left inside each opening forelectrically connecting the corresponding pad. (g) An exteriorconductive body, electrically connected to an exterior circuit and toeach pad, is provided, and the LED wafer is diced into a plurality ofLED packages.

A method for producing an LED package includes the following steps. (a)An LED die, including a conductive region-forming surface and aplurality of conductive regions disposed on the conductiveregion-forming surface, is provided. (b) A reflection layer is adheredto the LED die. The reflection layer is opposite the conductiveregion-forming surface. (c) A substrate is provided. The substrate has adie-installation surface to which the LED die is connected via thereflection layer. The substrate includes two connection members inaccordance with the conductive regions for electrical connection,respectively, and each connection member extends from thedie-installation surface to a predetermined portion of a back surface ofthe substrate, opposite the die-installation surface, for electricallyconnecting an exterior circuit. (c) A binding wire connects a respectivepad and a corresponding connection member. (d) A protection layer coversthe substrate for enclosing the LED die and the binding wire.

A method for producing an LED package includes the following steps. (a)An LED wafer is provided, which includes a plurality of LED sections.Each LED section includes a conductive region-forming surface and aplurality of conductive regions disposed on the conductiveregion-forming surface. (b) A first insulation layer is installed on theconductive region-forming surface of each LED section. (c) A metallicreflection layer is formed on the first insulation layer. (d) A secondinsulation layer is formed on the metallic reflection layer, and thesecond insulation layer is patterned with a plurality of openings so asto expose the metallic reflection layer. (e) The metallic reflectionlayer is patterned with a plurality of through holes in order to exposethe first insulation layer. (f) The first insulation layer is patternedwith a plurality of channels that communicate with the through holes,respectively, so as to communicate with the through holes. (g) A thirdinsulation layer is formed on the second insulation layer besides theopenings, and the third insulation layer is patterned with a pluralityof penetrating holes in accordance with the openings, the through holesand the channels, in order to expose the corresponding conductiveregions, respectively. (h) A conductive formation layer is disposed onthe third insulation layer, an exposed portion thereof that is higherthan the third insulation layer is removed, and a conductive member isleft inside each penetrating hole for electrically connected thecorresponding conductive region. (i) An exterior conductive body,electrically connected to an exterior circuit and to each conductiveregion, is provided, and the LED wafer is diced into a plurality of LEDpackages.

To provide a further understanding of the invention, the followingdetailed description illustrates embodiments and examples of theinvention. Examples of the more important features of the invention havethus been summarized rather broadly in order that the detaileddescription thereof that follows may be better understood, and in orderthat the contributions to the art may be appreciated. There are, ofcourse, additional features of the invention that will be describedhereinafter which will form the subject of the claims appended hereto.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other features, aspects, and advantages of the presentinvention will become better understood with regard to the followingdescription, appended claims, and accompanying drawings, where:

FIGS. 1 to 4 are cross-sectional profiles of a first embodiment of anLED package according to the present invention;

FIGS. 5 to 8 are cross-sectional profiles of a second embodiment of theLED package according to the present invention;

FIGS. 9 to 14 are cross-sectional profiles of a third embodiment of theLED package according to the present invention;

FIGS. 15 and 16 are cross-sectional profiles of a fourth embodiment thean LED package according to the present invention;

FIGS. 17 to 21 are cross-sectional profiles of a fifth embodiment of theLED package according to the present invention;

FIGS. 22 and 23 are cross-sectional profiles of a sixth embodiment ofthe LED package according to the present invention;

FIG. 24 is a side view of a reflection layer of a conventional LEDpackage;

FIG. 25 is a side view of a reflection layer of another conventional LEDpackage; and

FIG. 26 is a cross-sectional profile of the conventional LED package.

DETAILED DESCRIPTION OF THE EMBODIMENTS

A first embodiment of an LED package of the present invention isillustrated in FIGS. 1 to 4. An LED wafer, partially shown in FIG. 1, isprovided first. The LED wafer 1 includes a plurality of LED sections 10,and only one LED section 10 is shown. Each LED section 10 includes anLED die, and for ease of explanation, only one LED section 10 will begiven as an example. Each LED section 10 includes a conductiveregion-forming surface 100 and at least two conductive regions 101disposed on the conductive region-forming surface 100. Each conductiveregion 101 has disposed thereon a metallurgic layer (not shown) as a UBM(Under Bump metallurgy) in a proper manner. According to the firstembodiment, a main light-emission surface on each LED section 10 isopposite the conductive region-forming surface 100.

A photosensitive insulation layer 20, which is composed of polyimidematerials or the like, is formed on the conductive region-formingsurface 100. The insulation layer 20 is patterned with a plurality ofopenings 200 corresponding to the conductive regions, respectively..

After the openings 200 are formed, a conductive formation layer 30,illustrated in FIGS. 2 and 3, is formed on a whole surface of theinsulation layer 20 and reveals portions of the conductiveregion-forming surface 100 via the openings 200 by means of, forexample, printing. The conductive formation layer 30 includes, forexample, conductive adhesives or the like. Furthermore, the conductiveformation layer 30 is ground so as to remove part of the conductiveformation layer formed on the insulation layer 20, thereby leavingremaining of the conductive formation layer inside the openings 200serve as conductive members 40 that connect corresponding conductiveregions 101.

Over each conductive member 40 is disposed with a metallic layer 401 byany proper manner in FIG. 4. Each metallic layer 40 includes a nickellayer and a gold layer, or may be formed from other appropriate metallicmaterials. On each metallic layer 40 is disposed an exterior conductivebody 50 used for electrically connecting an exterior circuit (notshown). Then, the LED wafer 1 is diced along a dicing line (not shown)into a plurality of LED packages.

There are some advantages in the first embodiment of the presentinvention:

-   -   1. A sheet of the LED wafer 1 is processed. That means a        plurality of LED sections 10 are processed simultaneously and        the manufacturing quantity is improved.    -   2. The conductive members 40 are formed by reflective and        conductive material, so that they can be treated as reflection        layers. Therefore, as shown in FIG. 4, the light toward the        conductive members 40, as indicated by solid arrows, will be        reflected and emitted through the main light-emission surface,        as indicated by the dotted arrows. Thus, the illumination        provided tby the LED package will be improved as compared with        the prior art. A second embodiment of the LED package of the        present invention is illustrated in FIGS. 5 to 8. An LED wafer,        partially shown in FIG. 5, is similar to that shown in FIG. 1.        After the openings 200 are formed, a conductive formation layer        30 is formed on the whole surface of the insulation layer 20 and        the revealed portions of the conductive region-forming surface        100 via the openings 200 by means of, for example, sputtering.        The conductive formation layer 30 can be made of appropriate        materials by any other proper manners.

The conductive formation layer 30 is ground so as to remove part of theconductive formation layer 30 formed on the insulation layer 20, therebyleaving remaining of the conductive formation layer 30 inside theopenings 200 to serve as conductive members 40 that connectcorresponding conductive regions 101 (in FIG. 6).

Referring to FIG. 7, an auxiliary layer 64 is formed on the wholesurface of the insulation layer 20. The auxiliary layer 64 is furtherpatterned so as to form a plurality of passageways 640 that communicatewith corresponding openings 200. Each passageway 640 and thecorresponding one of the openings 200 together form a conductive-bodyformation hole.

Inside each conductive-body formation hole, an exterior conductive body50 is disposed in order to connect electrically the correspondingconductive member 40. The exterior conductive body 50 has an exposedportion exposed by the conductive-body formation hole. In a preferredembodiment, the exterior conductive body 50 can be a solder bump.

In FIG. 8, the exposed portion of the exterior conductive body 50 can beground flat and the auxiliary layer 64 is then removed.

Finally, the LED wafer 1 can be diced along a dicing line (not shown)into a plurality of LED packages.

Advantages of the second embodiment are the same as those in the firstembodiment.

A third embodiment of the LED package of the present invention isillustrated in FIGS. 9 to 14. An LED wafer is provided in FIGS. 9 and10, and is similar to that shown in FIG. 1.

With respect to FIG. 11, a photosensitive and transparent firstinsulation layer 60, which is composed of polyimide materials or thelike, is formed on the conductive region-forming surface 100.

A metallic reflection layer 61 is disposed on the first insulation layer60. The metallic reflection layer 61 is a metallic thin film of highreflectivity. The metallic reflection layer 61 can be formed by coatingmetal material or by adhering a metal thin film on the first insulationlayer 60. When the metallic reflection layer 61 is formed by coatingmetal material on the first insulation layer 60, the metallic refectionlayer 61 can be formed with a plurality of through holes 610corresponding to the conductive regions 101 by appropriate chemicalprocesses. When the metallic reflection layer 61 is formed by adhering ametal thin film on the first insulation layer 60 the through holes 610are formed in the metal thin film before adhered on the first insulationlayer 60, and thus, the chemical processes can be omitted. In thisembodiment, the metallic reflection layer 61 is formed by adhering ametal thin film on the first insulation layer 60.

In FIG. 12, the first insulation layer 60 can be patterned to form aplurality of channels 600 each registered with a corresponding one ofthe through holes 610 by using the metallic reflection layer 61 as amask. A second insulation layer 62 is formed on a whole surface of themetallic reflection layer 61 and is patterned to forma plurality ofopenings 620 each extending through a corresponding through hole 610 anda corresponding channel 600 registered with the corresponding throughhole 610 and reaching a corresponding conductive region 101, such thatthe opening-confining wall of each of the opening 620 is transverse to aplane of the layer 61 to isolate the layer 61 from the correspondingconductive region 101 while permitting access to the correspondingconductive region 101.

A conductive formation layer 70 can be formed on a whole surface of thesecond insulation layer 62 and the revealed portions of the conductiveregion-forming surface 100 via the openings 620 (in FIG. 13). Theconductive formation layer 70 can be ground so as to remove part of theconductive formation layer 70 formed on the insulation layer 20, therebyleaving remaining of the conductive formation layer 70 inside theopenings 600 to serve as conductive members 700 that connectcorresponding conductive regions 101

As in the first embodiment, on each of the conductive members 700 issequentially disposed a metallic layer 701 and an exterior conductivebody 50. The LED wafer 1 can be diced along a dicing line (not shown)into a plurality of LED packages.

The advantages of the third embodiment are the same as those in thefirst embodiment.

FIGS. 15 and 16 show the method for the LED package according to afourth embodiment of the present invention. Unlike the third embodiment,after the opening 620 is formed, a conductive formation layer 30 isformed on the whole surface of the second insulation layer 62 and therevealed portions of the conductive region-forming surface 100 by meansof, for example, sputtering (in FIG. 15).

Then, the conductive formation layer 30 is ground so as to remove partof the conductive formation layer 30 formed on the second insulationlayer 62, thereby leaving remaining of the conductive formation layer 30inside the openings 620 to serve as conductive members 40 that connectcorresponding conductive regions 101

The exterior conductive body 50 can be formed in steps similar to thoseof the second embodiment. Finally, the LED wafer 1 is diced along adicing line (not shown) into a plurality of LED packages.

FIGS. 17 to 21 show the method for the LED package according to a fifthembodiment. As shown in FIG. 17, an LED wafer 1 similar to that of thethird embodiment is provided.

A photosensitive and transparent first insulation layer 60, a metallicreflection layer 61 formed from a metallic thin film having highreflectivity, and a photosensitive second insulation layer 62 aresequentially formed on the conductive region-forming surface 100.

Referring to FIG. 18, the second insulation layer 62 is patterned toform a plurality of openings 620 for exposing portions of the metallicreflection layer 61 registered with the corresponding conductive regions101.

After the openings 620 are formed, by the use of chemical processes, themetallic reflection layer 61 is processed to form a plurality of throughholes 610 each registered with a corresponding one of the openings 620.

Subsequently, the first insulation layer 60 is patterned to formaplurality of channels 600 each registered with a corresponding one ofthe openings 620 and exposing a corresponding one of the conductiveregions while using the second insulation layer 62 and the metallicreflection layer 61 as masks.

As shown in FIG. 19, a third insulation layer 63 is formed on a wholesurface of the second insulation layer 62 and the revealed portion ofthe conductive region-forming surface via the openings 620. The thirdinsulation layer 62 is patterned to form a plurality of penetratingholes 630 each extending through a corresponding opening 620, acorresponding through hole 610 and a corresponding channel 600registered with the corresponding through hole 610 and reaching acorresponding conductive region 101, such that the opening-confiningwall of each of the penetrating holes 630 is transverse to a plane ofthe layer 61 to isolate the layer 61 from the corresponding conductiveregion 101 while permitting access to the corresponding conductiveregion 101

It should be noted that, in this embodiment, the second and thirdinsulation layer 620 and 630 cooperatively serving as the secondinsulation layer 620 in the third and fourth embodiments.

After the penetrating hole 630 is formed, a conductive formation layer70 is formed on a whole surface of the third insulation layer 63 andrevealed portions of the conductive region-forming surface 100, as shownin FIG. 20.

Referring to FIG. 21, the conductive formation layer 70 is ground so asto remove part of the conductive formation layer 70 formed on the thirdinsulation layer 63, thereby leaving remaining of the conductiveformation layer 70 inside the conductive-body formation holes eachformed from one through hole 610, one channel 600, one opening 620 andone penetrating hole 630 that are registered one another, to serve asconductive members 40 that connect corresponding conductive regions 101

Then, on each of the conductive members 700 is disposed with themetallic layer 701 and the exterior conductive body 50 like those in thefirst embodiment. Finally, the LED wafer 1 is diced along a dicing line(not shown) into a plurality of LED packages.

Advantages of the third embodiment are the same as those in the firstembodiment.

FIGS. 22 and 23 illustrate a sixth embodiment of the present invention.Unlike the fifth embodiment, after the penetrating hole 630 is formed inFIG. 22, a conductive formation layer 30 is formed on a whole surface ofthe third insulation layer 63 and the exposed portions of the conductiveregion-forming surface 100 by means of, for example, sputtering.

In FIG. 23, the conductive formation layer 30 is ground so as to removepart of the conductive formation layer 30 formed on the third insulationlayer 63, thereby leaving remaining of the conductive formation layer 30inside the penetrating holes 630 to serve as conductive members 40 thatconnect corresponding conductive regions 101.

After the formation of the conductive members 40, exterior conductivebodies 50 is formed in a similar manner as in the second embodiment, andthe LED wafer 1 is diced along a dicing line (not shown) into aplurality of LED packages.

The advantages of the third embodiment are the same as those in thefirst embodiment.

FIG. 24 is a schematic side view showing the conventional LED package inFIG. 26 to which the metallic reflection layer in the present inventionis applied. It should be noted that, a protection layer is removed, andsome elements are partially exposed in FIG. 24.

The metallic reflection layer 61 is disposed between the substrate 91and the conductive region-forming surface of the LED die 90 opposite tothe conductive region-forming surface 900; thus the which is originallywasted is reflected and emitted through the main light emission surface900, thereby increasing the illumination of the LED package.

FIG. 25 is a schematic side view showing the conventional LED package inFIG. 26 to which the metallic reflection layer in the present inventionis applied. It should be noted that, a protection layer is removed, andsome elements are partially exposed in FIG. 25.

In addition to the metallic reflection layer 61 disposed between thesubstrate 91 and the opposed surface of the LED die 90 opposite to theconductive region-forming surface 900, a metallic reflection layer 61 isalso disposed on a side surface of the LED die 90, thus the light whichis originally wasted is reflected and emitted through the main lightemission surface 900, thereby increasing the illumination of the LEDpackage.

It should be apparent to those skilled in the art that the abovedescription is only illustrative of specific embodiments and examples ofthe invention. The invention should therefore cover variousmodifications and variations made to the herein-described structure andoperations of the invention, provided they fall within the scope of theinvention as defined in the following appended claims.

1. An LED package, comprising: an LED die having a conductiveregion-forming surface and a plurality of conductive regions disposed onthe conductive region-forming surface; an insulation layer formed on theconductive region-forming surface of the LED die, and having a pluralityof openings corresponding to the conductive regions, respectively; and aconductive member filling a respective one of the openings, andelectrically connected a respective one of the conductive regions to anexterior circuit.
 2. The LED package as claimed in claim 1, wherein theconductive member is made of conductive adhesives.
 3. The LED package asclaimed in claim 2, further including a metallic layer formed on theconductive member.
 4. The LED package as claimed in claim 3, furtherincluding an exterior conductive body disposed on the metallic layer. 5.The LED package as claimed in claim 3, wherein the metallic layerincludes a nickel layer and a gold layer.
 6. The LED package as claimedin claim 1, further including a metallurgic layer formed on a respectiveone of the conductive regions.
 7. The LED package as claimed in claim 1,wherein each opening communicates with a corresponding one of conductiveregions.
 8. The LED package as claimed in claim 1, wherein theconductive member is made of metallic material by a sputtering process.9. The LED package as claimed in claim 8, further including an exteriorconductive body disposed on the conductive member.
 10. The LED packageas claimed in claim 9, wherein the exterior conductive body is a solderbump.
 11. An LED package, comprising: an LED die having a conductiveregion-forming surface and a plurality of conductive regions disposed onthe conductive region-forming surface; a first insulation layer formedon the conductive region-forming surface of the LED die, and having aplurality of channels corresponding to the conductive regions,respectively; a metallic reflection layer formed on the first insulationlayer, and having a plurality of through holes corresponding thechannels, respectively; a second insulation later formed on the metallicreflection layer, and having a plurality of openings corresponding tothe conductive regions via the channels and the through holes,respectively; and a conductive member filling a respective one of theopenings, and electrically connected a respective one of the conductiveregions to an exterior circuit.
 12. The LED package as claimed in claim11, wherein the conductive member is made of conductive adhesives. 13.The LED package as claimed in claim 12, further including a metalliclayer formed on the conductive member.
 14. The LED package as claimed inclaim 13, further including an exterior conductive body disposed on themetallic layer.
 15. The LED package as claimed in claim 14, wherein themetallic layer includes a nickel layer and a gold layer.
 16. The LEDpackage as claimed in claim 11, further including a metallurgic layerformed on a respective one of the conductive regions.
 17. The LEDpackage as claimed in claim 11, wherein the conductive member is made ofmetallic material by a sputtering process.
 18. The LED package asclaimed in claim 17, further including an exterior conductive bodydisposed on the conductive member.
 19. The LED package as claimed inclaim 18, wherein the exterior conductive body is a solder bump.
 20. TheLED package as claimed in claim 11, wherein each opening extends througha corresponding one of the through holes and a corresponding one of thechannels registered therewith and reaching a corresponding one ofconductive regions, such that an opening-confining wall of each of theopenings is transverse to a plane of the metallic reflection layer toisolate the metallic reflection layer from the a corresponding one ofthe conductive regions, while permitting access to the corresponding oneof the conductive regions..
 21. An LED package, comprising: an LED diehaving a conductive region-forming surface and a plurality of conductiveregions disposed on the conductive region-forming surface; a reflectionlayer formed on an opposed surface of the LED die opposite theconductive region-forming surface; a substrate having a die-installationsurface, whereon the LED die is disposed via the reflection layer, andwherein the substrate includes a plurality of connection members inaccordance with the conductive regions for electrical connection,respectively, and each connection member extends from thedie-installation surface to a predetermined portion of a back surface ofthe substrate, opposite the die-installation surface, for electricallyconnecting an exterior circuit; a binding wire connecting a respectiveone of the conductive regions and a corresponding one of the connectionmembers; and a protection layer covering the substrate for enclosing theLED die and the binding wire.
 22. The LED package as claimed in claim21, further including a reflection layer adhered to a surface of the LEDdie.
 23. A method for producing an LED package, comprising: providing anLED wafer, including a plurality of LED sections, wherein each LEDsection includes a conductive region-forming surface and a plurality ofconductive regions disposed on the conductive region-forming surface;forming an insulation layer on the conductive region-forming surface ofeach LED section, and patterning the insulation layer with a pluralityof openings corresponding to the conductive regions, respectively;making a conductive formation layer on the insulation layer with theopenings, and removing the conductive layer and leaving a conductivemember filled inside each opening; and arranging an exterior conductivebody on the conductive member, and dicing the LED wafer into a pluralityof LED packages.
 24. The method as claimed in claim 23, furtherincluding: providing a metallurgic layer on each conductive regionbefore the step of making the conductive formation layer.
 25. The methodas claimed in claim 23, wherein making the conductive formation layerincludes providing a conductive adhesive as the conductive formationlayer.
 26. The method as claimed in claim 25, further includingproviding a metallic layer on the conductive member before the step ofarranging the exterior conductive body.
 27. The method as claimed inclaim 26, wherein making the conductive formation layer includes forminga nickel layer and a gold layer as the metallic layer.
 28. The method asclaimed in claim 23, wherein pattering the openings includescommunicates with a corresponding one of conductive regions.
 29. Themethod as claimed in claim 23, wherein making the conductive formationlayer includes sputtering metallic materials in order to form theconductive formation layer.
 30. The method as claimed in claim 29,wherein arranging the exterior conductive body includes: forming anauxiliary insulation layer on the insulation layer and patterning aplurality of passageways corresponding to the openings, respectively,wherein each passageway extending through a corresponding one of theopenings for reaching a corresponding one of conductive regions, andeach passageway and the corresponding one of the openings together forma conductive-body formation hole; arranging an exterior conductive bodyin the conductive-body formation hole to connect electrically thecorresponding conductive member, wherein the exterior conductive body isexposed out of the conductive-body formation hole; and removing anexposed portion of the exterior conductive body to flatten the exteriorconductive body, and removing the auxiliary insulation layer.
 31. Themethod as claimed in claim 30, wherein arranging the exterior conductivebody includes arranging a solder bump as the exterior conductive body.32. A method for producing an LED package, comprising: providing an LEDwafer, including a plurality of LED sections, wherein each LED sectionincludes a conductive region-forming surface and a plurality ofconductive regions disposed on the conductive region-forming surface;forming a first insulation layer on the conductive region-formingsurface of each LED section; making a metallic reflection layer on thefirst insulation layer, and patterning the metallic reflection layerwith a plurality of through holes in order to expose the firstinsulation layer; patterning the first insulation layer with a pluralityof channels communicating with the through holes, respectively, so as toexpose the corresponding conductive regions; forming a second insulationlayer on the metallic reflection layer, and patterning the secondinsulation layer with a plurality of openings in accordance with thethrough holes and the channels, so as to expose the correspondingconductive regions; disposing a conductive formation layer on the secondinsulation layer, removing an exposed portion thereof higher than thesecond insulation layer, and leaving a conductive member inside eachopening for electrically connected the corresponding one of conductiveregions; and providing an exterior conductive body electricallyconnected to an exterior circuit and to the corresponding one ofconductive regions, and dicing the LED wafer into a plurality of LEDpackages.
 33. The method as claimed in claim 32, further includingproviding metallurgic layer on each pad before the step of making thefirst insulation layer.
 34. The method as claimed in claim 32, whereinforming the conductive formation layer includes providing a conductiveadhesive as the conductive formation layer.
 35. The method as claimed inclaim 34, further including a metallic layer formed on the conductivemember before the step of disposing the exterior conductive body. 36.The method as claimed in claim 35, wherein forming the metallic layerincludes providing a nickel layer and a gold layer formed together asthe metallic layer.
 37. The method as claimed in claim 32, whereinforming the second insulation layer includes providing each openingextending through a corresponding one of the through holes and acorresponding one of the channels registered with the correspondingthrough hole and reaching a corresponding one of conductive regions,such that an opening-confining wall of each of the openings istransverse to a plane of the metallic reflection layer to isolate themetallic reflection layer from the corresponding one of the conductiveregions, while permitting access to the corresponding one of theconductive regions.
 38. The method as claimed in claim 32, whereinforming the conductive formation layer includes sputtering metallicmaterials in order to form the conductive formation layer.
 39. Themethod as claimed in claim 38, wherein arranging the exterior conductivebody includes: forming an auxiliary insulation layer on the secondinsulation layer and patterning a plurality of passageways correspondingto the openings, respectively, wherein each passageway extending througha corresponding one of the openings, and each passageway and thecorresponding opening together form a conductive-body formation hole;arranging an exterior conductive body in the conductive-body formationhole to connect electrically the corresponding conductive member,wherein the exterior conductive body is exposed out of theconductive-body formation hole; and removing an exposed portion of theexterior conductive body to flatten the exterior conductive body, andremoving the auxiliary insulation layer.
 40. The method as claimed inclaim 39, wherein arranging the exterior conductive body includesarranging a solder bump as the exterior conductive body.
 41. A methodfor producing an LED package, comprising: providing an LED die,including a conductive region-forming surface and a plurality ofconductive regions disposed on the conductive region-forming surface;adhering a reflection layer to the LED die, wherein the reflection layeris opposite the conductive region-forming layer; providing a substratehaving a die-installation surface, to which the LED die is connected viathe reflection layer, wherein the substrate includes two connectionmembers in accordance with the conductive regions for electricalconnection, respectively, and each connection member extends from thedie-installation surface to a predetermined portion of a back surface ofthe substrate, opposite the die-installation surface, for electricallyconnected an exterior circuit; a binding wire connected a respective oneof the conductive regions and a corresponding one of the connectionmembers; and a protection layer covers the substrate for enclosing theLED die and the binding wire.
 42. The method as claimed in claim 41,further including adhering a reflection layer to a surface of the LEDdie.
 43. A method for producing an LED package, comprising: providing anLED wafer, including a plurality of LED sections, wherein each LEDsection includes a conductive region-forming surface and a plurality ofconductive regions disposed on the conductive region-forming surface;forming a first insulation layer on the conductive region-formingsurface of each LED section; making a metallic reflection layer on thefirst insulation layer, forming a second insulation layer on themetallic reflection layer, and patterning the second insulation layerwith a plurality of openings so as to expose the metallic reflectionlayer; patterning the metallic reflection layer with a plurality ofthrough holes in order to uncover the first insulation layer; patterningthe first insulation layer with a plurality of channels communicatingwith the through holes, respectively, so as to communicate with thethrough holes; forming a third insulation layer on the second insulationlayer beside the openings, and patterning the third insulation layerwith a plurality of penetrating holes in accordance with the openings,the through holes and the channels, in order to expose the correspondingconductive regions, respectively disposing a conductive formation layeron the third insulation layer, removing an exposed portion thereofhigher than the third insulation layer, and leaving a conductive memberinside each penetrating hole for electrically connected thecorresponding pad; and providing an exterior conductive bodyelectrically connected to an exterior circuit and to each conductiveregion, and dicing the LED wafer into a plurality of LED packages. 44.The method as claimed in claim 43, further including providingmetallurgic layer on each conductive region before the step of makingthe first insulation layer.
 45. The method as claimed in claim 43,wherein forming the conductive formation layer includes providing aconductive adhesive as the conductive formation layer.
 46. The method asclaimed in claim 45, further including a metallic layer formed on theconductive member before the step of disposing the exterior conductivebody.
 47. The method as claimed in claim 46, wherein forming themetallic layer includes providing a nickel layer and a gold layer formedtogether as the metallic layer.
 48. The method as claimed in claim 43,wherein forming the third insulation layer includes providing eachpenetrating hole extending through a corresponding opening, acorresponding through hole and a corresponding channel registered withthe corresponding through hole and reaching a corresponding conductiveregion, such that an opening-confining wall of each of the penetratingholes is transverse to a plane of the metallic reflection layer toisolate the metallic reflection layer from a corresponding one of theconductive regions while permitting access to the corresponding one ofthe conductive regions.
 49. The method as claimed in claim 43, whereinforming the conductive formation layer includes sputtering metallicmaterials in order to form the conductive formation layer.
 50. Themethod as claimed in claim 49, wherein arranging the exterior conductivebody includes: forming an auxiliary insulation layer on the thirdinsulation layer and patterning a plurality of passageways correspondingto the through holes, respectively, wherein each passageway communicateswith corresponding openings , and each passageway and one of thecorresponding through holes together form a conductive-body formationhole; arranging an exterior conductive body in the conductive-bodyformation hole to connect electrically the corresponding conductivemember, wherein the exterior conductive body is exposed out of theconductive-body formation hole; and removing an exposed portion of theexterior conductive body to flatten the exterior conductive body, andremoving the auxiliary insulation layer.
 51. The method as claimed inclaim 50, wherein arranging the exterior conductive body includesarranging a solder bump as the exterior conductive body.